Meet Your
UHDI PCB and IC Substrate Experts
As the electronics industry moves towards finer linewidths and higher feature densities in PCBs and packaging, IC substrates will become a dominant part of product development for advanced electronics. We apply our electronics design expertise to IC substrate designs to enable a new range of products with diverse in-package functionality. Come work with NWES to learn more and start your next project.
Our Capabilities
UHDI Design for IC Substrates and SLPs
A focus on product design requires addressing electronics performance capabilities at all levels, from the completed PCBA down to individual ICs. As densities in electronics packaging have increased, many designs are requiring an ultra-HDI (UHDI) approach that spans across IC packaging, substrate-like PCBs, and traditional PCBs through a unified design process.
During the substrate design process, we work directly with your fabrication facility to ensure manufacturability and scalability in the finalized IC substrate design. Our goal is to deliver a design and data package that ensures reliable and scalable manufacturing. Our collaborative approach reflects best practices and helps you reach success.
Our IC Substrate Focus
Rigid & Flex IC Substrates
Substrate-like PCBs
Multi-chip Modules
Chip-on-Board Packaging
System-in-Package
2.5D and 3D Packaging
Design Applications
We target advanced areas on the cutting edge of heterogeneous integration, 2.5D/3D packaging, and advanced high-frequency systems enabling cutting-edge applications and products.
- BGA/Flip-chip/CSP IC substrate design
- Substrates for advanced 2.5D/3D integrated processors
- RF modules with antenna-in-package
- Substrate-like PCBs (down to 10 micron L/S)
- System-on-module (SoM) designs
- Channel extraction, modeling, and verification
Quality and Capabilities
Our overseas fabrication partners provide advanced capabilities that help our clients scale to high volume. We work directly with overseas vendors to ensure our designs are high quality with high yield, and we help smooth the transition to high volume production.
- Quality controls - Our IC substrate vendor partners are ISO-9001, AS9100, NADCAP, and/or RoHS/REACH compliant.
- UHDI approach - High layer count for substrate-like PCBs, multi-chip modules, and chip-on-board packaging.
- Feature sizes - 15/15 µm linewidth/spacing, 45/95 µm laser-drilled via/pad sizes, bump pitch based on fabricator capabilities.
Our Process
We provide customers with PCB design and advanced packaging design solutions to accelearte the innovation process for cutting-edge electronics.- Contact us for a consultation and quote.
- Send us all available packaging documentation detailing ball-outs, RDL/interposer requirements, and schematics showing electrical requirements. If in-package components are required, include an engineering BOM in your data package.
- We'll send you completed flat or hierarchical schematics, layout data, 3D models, fabrication documentation, and manufacturing BOMs.
- Throughout the design process, we'll collaborate with you on any required design changes and provide suggestions to improve your new product.
Why Work With NWES?
- Broad expertise - We're a digitally-driven remote-first organization with diverse talent and experience. We know your technology because we've used it and built it.
- Manufacturing partners - We work with local and overseas CMs and EMS providers that are ISO-9001, AS9100, ISO-13485, IPC-A-610, NADCAP, and/or ITAR/JCP certified. We help you find the best option to produce prototypes and scale to volume production.
- Supply chain management - We take a proactive approach on projects to ensure your design can be produced at the required volume. We'll manage procurement from major distributors or brokers throughout your project.
Need a hand with a current or future IC substrate design project? Find out the difference our experts can make.
Contact us today for more information.
Our Clients and Partners
