As the electronics industry moves towards finer linewidths and higher feature densities in PCBs and packaging, IC substrates will become a dominant part of product development for advanced electronics. We apply our electronics design expertise to IC substrate designs to enable a new range of products with diverse in-package functionality. Come work with NWES to learn more and start your next project.
A focus on product design requires addressing electronics performance capabilities at all levels, from the completed PCBA down to individual ICs. As densities in electronics packaging have increased, many designs are requiring an ultra-HDI (UHDI) approach that spans across IC packaging, substrate-like PCBs, and traditional PCBs through a unified design process.
During the substrate design process, we work directly with your fabrication facility to ensure manufacturability and scalability in the finalized IC substrate design. Our goal is to deliver a design and data package that ensures reliable and scalable manufacturing. Our collaborative approach reflects best practices and helps you reach success.
We target advanced areas on the cutting edge of heterogeneous integration, 2.5D/3D packaging, and advanced high-frequency systems enabling cutting-edge applications and products.
Our overseas fabrication partners provide advanced capabilities that help our clients scale to high volume. We work directly with overseas vendors to ensure our designs are high quality with high yield, and we help smooth the transition to high volume production.