PDN Impedance Calculator

Interactive power delivery network tool: decoupling capacitor selection, plane capacitance, BGA via inductance, and capacitor mounting analysis.

Target Impedance
Decap Selection
Parasitics
×
Parasitics Summary
Stage R L / C
VRM
Spreading
BGA Via
Plane Cap
Additional Cap Groups
Extra decap groups placed in parallel with primary cap (like multi-group setup)
Footprint C (µF) Qty Layer Orient
No extra groups. Click + Add Group.
Computed Results
Ztarget
Ω
Zeff @ Ft
Ω
SRF
MHz
Suggested N
caps (auto)
ESR
Ω
ESL
nH
Lmnt
nH
Ltotal
nH
Impedance vs. Frequency — Web Calculated

Log-log plot · All impedances in Ω · Ztotal (black) vs Ztarget (dashed red) · Curve names shown at line end

Component Library

All values editable. Changes are session-only (not saved). Values used by the Decap Selection calculator.

Standard Decoupling Caps — ESR/ESL by Footprint & C value
Footprint C (µF) ESR (Ω) ESL (nH) Lmnt (nH)
Bulk Capacitors
C (µF) Bulk ESR (Ω) Bulk ESL (nH) Bulk Lmnt (nH) Custom ESR (Ω) Custom ESL (nH) Custom Lmnt (nH)
VRM (Voltage Regulator Module)
TypeESR (Ω)ESL (nH)
Linear
Switcher
Custom
Spreading R and L
TypeRs (Ω)Ls (nH)
Ignore
Low
Medium
High
User Define
X2Y Capacitors
FootprintC (µF)ESR (Ω)ESL (nH)
BGA Via & Plane Cap (Library Reference)
BGA Via
ParamValue
ESR (Ω)
ESL (nH)
Plane Capacitance
ParamValue
ESR (Ω)
C (µF)
Dielectric Materials
MaterialEr
Plane Geometry Inputs

Dielectric Layer 1


Dielectric Layer 2

Plane capacitance cross-section diagram
Plane Capacitance — cross-section reference diagram
Outputs
C1 (Layer 1)
µF
C2 (Layer 2)
µF
Ctotal (series)
µF
Rtotal
Formula: C (pF) = 0.2249 × Er × L × W / h (mils).
Series: Ctotal = C1·C2 / (C1+C2). R = ρCu × L / (W × t), ρCu=6.787×10-4 Ω·mil.
Reference values @ defaults: C1 = 0.05510 µF, C2 = 0.00798 µF, Ctotal = 0.06298 µF, R = 0.00191 Ω.
Via Geometry Inputs
BGA Via geometry diagram
BGA Via Geometry — reference diagram
Outputs
Llin (L/C, per mil)
nH/mil
Lvia (with coupling)
nH
Rvia (single)
Lvia_eff (N pairs)
nH
Rvia_eff (N pairs)
Formulas (verified vs XLS):
Lvia = 2 × 5.08×10⁻³ × C × ln(2B/OD) nH  (loop inductance, anti-parallel pair, no −1 term)
Llin = Lvia / C  (nH/mil — XLS normalised display value)
Rvia = ρCu × C / (π×((OD/2)²−(ID/2)²)) × 1000 × 9.076 mΩ
Effective (N pairs): Leff = Lvia/N, Reff = Rvia/N
Reference values @ defaults (OD=12, ID=10, B=50, C=45.9, N=50):
Llin=0.02160 nH/mil   Lvia=0.9913 nH   Rvia=8.174 mΩ
Leff=0.01983 nH   Reff=0.1635 mΩ

Enter via and pad geometry per package size. Ltop/Lbot are computed using polynomial curve-fit coefficients. Click Calculate All to update outputs.

Cap mounting geometry diagram
Cap Mounting Geometry — VOS / VOE reference diagram
Parameter 0201 0402 0603 0805 1206
Gap (mils)
Width (mils)
Pitch (mils)
t Cu (mils)
h diel (mils)
A (mils)
W_dim (mils)
r (mils)
B (mils)
C1 (mils)
C2 (mils)
thk (mils)
Ltop VOS (nH)
Lbot VOS (nH)
Ltop VOE (nH)
Lbot VOE (nH)
Formula Notes

Ltop and Lbot are computed using 3rd-order polynomial curve-fit equations derived from EM field solver data (Calc0201 through Calc1206 sheets in the XLS). Coefficients are embedded in the JS engine below. VOS = Via On Same side as cap pads. VOE = Via On Edge.

X2Y capacitors have 4 terminals (A, B, G1, G2). Enter geometry per package. Ltop/Lbot are computed via polynomial curve-fits from the X2Y_Mount sheet.

* Refer to figures below for detailed pad layout and dimensions

X2Y Mount diagram 1
X2Y Mounting — top view
X2Y Mount diagram 2
X2Y Mounting — terminal layout

* Mounting inductance values for 'h' > 13.2 mils are extrapolated

Parameter 0603 0805 1206 1210
t Cu (mils)
h diel (mils)
W (mils)
r pad (mils)
G spacing (mils)
A-B space (mils)
G-A space (mils)
C1 (mils)
C2 (mils)
thk (mils)
Ltop (nH)
Lbot (nH)
Expected Outputs (For Reference)

With default inputs, X2Y 1210 package: Ltop ≈ 0.428 nH, Lbot ≈ 0.275 nH.



Analyze and Verify PDN Performance

This PDN calculator tool is originally based on the PDN Tool V1.1.1 from Altera Corporation. Originally intended for use with Altera FPGA devices, the tool has been generalized to any processor in a PCB that pulls power from a VRM, decoupling capacitor array, and power-ground plane pair.

This tool will help users design a robust PDN for a large processor by determining an optimum number, type, and value of decoupling capacitors needed to achieve a user-defined target impedance (Ztarget) up to the target frequency of interest. The equivalent schematic considered in this analysis is shown below.

PCB design process




Definition of Terms

Rvrm = Resistance of Voltage Regulator Module
Lvrm = Inductance of Voltage Regulator Module

Rc1...RcN = Equivalent Series Resistance of Decoupling Cap C1 to CN
Lc1...RcN = Equivalent Series Inductance of Decoupling Cap C1 to CN
Cc1...CcN = Capacitance of Decoupling Cap C1 to CN
Lmnt1...LmntN = Mounting Inductance of Decoupling Cap C1 to CN

Rp = Sheet Resistance of Parallel Plate Capacitor
Cp = Equivalent Parallel Plate Capacitance

Rs = Effective Spreading Resistance from BGA Device to Effective Decoupling Caps
Ls = Effective Spreading Inductance from BGA Device to Effective Decoupling Caps

Rv = Effective Resistance of PWR/GND BGA Via
Rv = Effective Inductance of PWR/GND BGA Via

Quick-Start Instructions

In the "Decap_Selection" tab:

  • Step 1: Select a VRM type, spreading inductance, BGA via inductance, and plane capacitance profile.
  • Step 2: Provide the following inputs to calculate a Ztarget:
    • Supply voltage
    • Maximum current
    • Transient current %
    • Ripple tolerance %
    • Frequency target
  • Step 3: Select various decoupling and bulk capacitors so that the Zeffective is below the Ztarget up to the required target frequency.



PDN Impedance in High-Speed PCB Design

Power integrity problems in a high-speed PCB are usually not caused by a lack of capacitance in the abstract. They come from a PDN whose impedance is too high over the frequency range where the load demands current. That is the point of target impedance. It gives you a design limit for the rail so switching events do not create excessive ripple, ground bounce, jitter, or other behavior that shows up later as a signal integrity problem. In that sense, the calculator is not just estimating capacitor behavior.

This is also why the tool includes more than capacitor value and capacitor count. A real PDN is a broadband network built from the regulator, bulk capacitance, discrete decoupling capacitors, mounting inductance, spreading inductance, plane capacitance, and the connection into the package through balls and vias. Each of those terms dominates over a different part of the impedance spectrum. At lower frequencies, the regulator and larger capacitors tend to matter most. As frequency increases, the loop inductance in the capacitor mounting structure, the BGA escape, and the plane pair begin to control the result. In faster systems, the board and package are not separate problems. They are two sections of the same power delivery path.

 

FPGA SOM

(a) PCB and (b) chip PDN contributions to impedance. [Source]

 

The most useful output is the impedance curve relative to the target line. If the curve stays below target, the rail has a better chance of meeting its ripple requirement during transient loading. If it rises above target, the problem is not automatically solved by placing more capacitors. A peak in the curve usually means the network has formed a resonance, and that same behavior will appear in the time domain as a stronger transient oscillation on the rail. In other words, the plot is showing where the PDN is likely to ring, not just where it has too little nominal capacitance.

Impedance Features Electrical Behavior
Curve exceeds target at low frequency Bulk capacitance or regulator-side support is insufficient.
Sharp midband peak Capacitor resonance and interconnect inductance are dominating the rail response.
High impedance at the upper end of the spectrum Plane capacitance, BGA via path, and package-side parasitics are limiting the PDN.

For high-speed layouts, a good PDN result usually points back to physical design decisions rather than BOM changes alone. Plane spacing, overlapping plane area, via count into the power-ground pair, capacitor package size, and mounting geometry all change the impedance curve in ways that matter more than simply increasing capacitor quantity. That is why PDN design has to be treated as part of stackup design and package escape planning, not as a cleanup step after placement and routing are already fixed.




Determining Target PDN Impedance

The reason we need to limit the PDN impedance below some target is because the magnitude of voltage ripple is related to the magnitude of current impulses drawn by I/Os on fast digital processors. The simple relation between these quantities is Ohm's law, where the PDN impedance is the conversion factor between current impulses and the transient voltage. This is why PDN impedance can be determined with a simple formula, which uses a voltage ripple value as a percentage of the stable core voltage and the peak current drawn by all I/Os running on the chip:

 

PDN impedance target

 

This gives a good estimate of the maximum impedance value that we can accept in the PDN. Any value below this maximum would be expected to produce a transient that, while complex in terms of time-domain complexity, maintains its amplitude within the noise margin for the I/O supply rail. As most processors have multiple rails operating at different voltages and current requirements, the same formula would apply to each rail independently (assuming separate regulators).

Once we have a target impedance design, it is possible to predict the transient response using an inverse Fourier transform, as shown in the formula below. This transform takes the input current pulse in the frequency domain and the PDN impedance spectrum, and the transient voltage can be predicted. Note that we can add a scale factor Veq to set the equivalent voltage to the stable (quiet) level required by the rail.

 

PDN impedance Fourier transform

 

This is equivalent to take the convolution of these quantities using the impulse response function for the PDN impedance function (Z). Any mathematical scripting language (MATLAB, Wolfram Mathematica, etc.) can perform these calculations in the frequency domain, although the impulse response function approach has largely been taken as the standard approach in EDA software.




Related Resources


DC DC Converter

Applications That Need Isolated DC/DC Converters

By A Mughees • Aug 26, 2024

There are many devices and applications that benefit from using an isolated DC/DC converter in the PCB.

transmission line low pass filter

Ferrite Beads in a PCB PDN with Heidi Barnes: OnTrack Bytes

By ZM Peterson • May 4, 2024

Heidi Barnes and Zachariah Peterson discuss the inappropriate usage of ferrite beads in a PDN in high-speed PCB design.

cover image

PCB Design for FPGA SoMs and Carrier Boards

By ZM Peterson • Sep 16, 2022

Learn about the design challenges and processes in PCB design for an FPGA SoM and its carrier board.



Getting Started

We provide customers with PCB design and advanced packaging design solutions to accelearte the innovation process for cutting-edge electronics.
  • Contact us for a consultation and quote.

  • Send your high-speed PCB data, including schematics, stackup targets, interfaces, routing constraints, power requirements, and models such as IBIS or S-parameters.

  • We evaluate performance from chip to board using SI and PI simulations and identify practical design improvements.

  • We work with your team to refine layout, stackup, routing, and PDN for performance and manufacturability.


How We Work

Why Work With NWES?


  • Broad expertise - We're a digitally-driven remote-first organization with diverse talent and experience. We know your technology because we've used it and built it.

  • Manufacturing partners - We work with local and overseas CMs and EMS providers that are ISO-9001, AS9100, ISO-13485, IPC-A-610, NADCAP, and/or ITAR/JCP certified. We help you find the best option to produce prototypes and scale to volume production.

  • Supply chain management - We take a proactive approach on projects to ensure your design can be produced at the required volume. We'll manage procurement from major distributors or brokers throughout your project.


Get Started


Need a hand with a current or future PCB design project? Find out the difference our experts can make.


Contact us today for more information.


    

You may include a ZIP file with your request (25 MB maximum)


Ready to work with NWES?
Contact us today for a consultation.

Contact Us Today

Our Clients and Partners