This Bluetooth module is based on the nRF52 WLCSP fine-pitch BGA package. Includes an EEPROM, programming header, I/O header, batter connector, and power/battery management. USB charging is not included at this time.
Major components include:
This compact module integrates a Nordic nRF52840 SoC in a wafer‑level chip scale package (WLCSP) with power management, EEPROM and a real‑time clock. The board is designed to operate from a battery and provides a pin header for programming and I/O. It is ideal for low‑power wireless applications such as wearable devices or sensor nodes.
This section outlines the primary components and features of the module. Understanding how the SoC, regulators and peripherals interact will help you integrate the board into your system.
Use the following steps to power, program and interface with the module safely and efficiently.
Compact wireless designs require HDI techniques and careful power management. The following points emphasize layout and low‑power considerations.
| Component | Function |
|---|---|
| nRF52840‑CKAA‑R7 | Bluetooth 5 SoC |
| TPS70933 | Low‑current LDO for 3.3 V rail |
| FR015L3EZ | Reverse‑polarity protection diode |
| PCF8523 RTC | Real‑time clock |
| CAT24C512 | 512 kB EEPROM |
Engineers can customize the firmware and peripheral connections to build compact sensors, trackers or wearables.
To optimize RF performance, keep the antenna area free of ground planes and route other traces away from it. Matching network components should be tuned while starting from the values in the reference design. The nRF52840 supports multiple protocols such as Bluetooth Low Energy, Thread and Zigbee; by selecting different firmware stacks, the module can adapt to various wireless networks. Use the EEPROM to store configuration data or sensor readings, and synchronize the real‑time clock with a network time source for accurate time stamping in data‑logging applications.
Read the full guide article on Altium Resources for a deep dive on this project. The video below shows the design approach and preparation for manufacturing of the Rev A release of this project, starting from schematic review and completing the PCB layout.