The Isola IS620i High Performance Laminate and Prepreg is designed for high-speed digital applications, making it an excellent choice for modern PCB stackups that require reliable performance across a wide frequency range. The material is specifically formulated for frequencies ranging from 2 to 15 GHz, providing low loss with a flat response over frequency, which is crucial for maintaining signal integrity in high-speed circuits. IS620i is available in both laminate and prepreg forms, allowing for versatile use in various PCB designs.

When constructing a PCB stackup using IS620i, it is important to consider the specific attributes of the material to optimize the PCB's performance. The material's glass transition temperature (Tg) is 225°C, and its decomposition temperature (Td) is 364°C, which are indicators of the material's thermal stability under high temperatures. This makes IS620i suitable for applications requiring high thermal reliability. The dielectric constant (Dk) is 3.58, and the dissipation factor (Df) is 0.006, ensuring minimal signal loss and delay.

For PCB fabrication, IS620i supports conventional FR-4 processing techniques, which simplifies the manufacturing process and reduces costs. It is compatible with standard material offerings such as full-size sheets or panel forms for laminates, and rolls or panel forms for prepregs. The material is also available with various copper foil types and weights, from ½ oz to 2 oz, providing flexibility in designing the copper layout according to the circuit requirements.

• Frequency Range: 2 to 15 GHz
• Thermal Properties: Tg of 225°C, Td of 364°C
• Electrical Properties: Dk of 3.58, Df of 0.006
• Processing: Compatible with conventional FR-4 techniques
• Material Forms: Available in laminate and prepreg forms
• Copper Options: Available in weights from ½ oz to 2 oz