This datasheet is made available for informational purposes only. For more information, such as processing guidance and full range of material options, this page includes design guidance that can help you start a new PCB project. For specific processing documentation and additional information, please visit the manufacturer's website.
The Isola IS420 is a high-performance, lead-free epoxy laminate and prepreg system designed for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are essential. With a glass transition temperature (Tg) of 170°C and a decomposition temperature (Td) of 350°C, IS420 is well-suited for environments that demand high thermal endurance. The material's dielectric constant (Dk) is 4.04, and its dissipation factor (Df) is 0.021, which are important properties for signal integrity and impedance control in high-speed circuit designs .
IS420 is compatible with standard FR-4 manufacturing processes, making it a versatile choice for a wide range of applications. It is also UV blocking and AOI (Automated Optical Inspection) fluorescent, enhancing its usability in modern PCB fabrication processes where these features are required for imaging and inspection. The material is available in various configurations, including different copper weights from ½ oz to 2 oz, and can be supplied in both full sheet or panel form for laminates and in roll or panel form for prepregs .
When designing a PCB stackup using IS420, consider the following guidelines:
Overall, IS420 offers a robust solution for demanding applications that require high thermal stability and reliability. Its compatibility with lead-free assembly processes and standard FR-4 fabrication techniques makes it a practical choice for a broad range of industrial applications. For detailed specifications and ordering information, contacting Isola directly is recommended to ensure you receive the most current and relevant data for your PCB design needs .
This guide covers material properties, application-specific selection, and key considerations for high-voltage, RF, high-speed digital, and HDI PCBs.