PCB Material Data For Isola IS410 Dielectric Constant (DK)/Dissipation Factor (DF) Table

This datasheet is made available for informational purposes only. For more information, such as processing guidance and full range of material options, this page includes design guidance that can help you start a new PCB project. For specific processing documentation and additional information, please visit the manufacturer's website.

Datasheet List Material Search Tool




How to Use Isola IS410 Dielectric Constant (DK)/Dissipation Factor (DF) Table

The Isola IS410 is a high-performance FR-4 epoxy laminate and prepreg system designed for the printed circuit board industry, particularly where higher levels of reliability and lead-free solder compatibility are required. The material features a glass transition temperature (Tg) of 180°C and a decomposition temperature (Td) of 350°C, making it suitable for multiple high-temperature processes. The dielectric constant (Dk) and dissipation factor (Df) vary across different frequencies, which is crucial for designing PCBs that operate at various signal frequencies. For instance, at 1 GHz, the Dk is approximately 3.97 with a Df of 0.0200【4:3†is410-data.pdf】.

When building a PCB stackup using IS410, it's essential to consider the specific requirements of your application, including the operating frequency and environmental conditions. The IS410 material is available in various configurations, with standard laminate thicknesses ranging from 2 to 125 mils and copper foil types such as HTE Grade 3 and RTF (Reverse Treat Foil). The material is also available in both full-size sheet and panel form, as well as in roll or panel form for prepregs, which offers flexibility in PCB design and fabrication【4:3†is410-data.pdf】.

Here are some guidelines for using IS410 in PCB stackup design:

  • Consider the operating frequency: Use the Dk and Df values provided for frequencies ranging from 100 MHz to 10 GHz to optimize the material selection for your specific application.
  • Account for thermal requirements: With a high Tg and Td, IS410 is well-suited for applications requiring multiple thermal excursions. Ensure that the stackup design can handle the thermal stresses associated with your application.
  • Choose the appropriate copper foil and thickness: Depending on the current carrying requirements and signal integrity needs, select the suitable copper weight and type offered with IS410.
  • Utilize the available forms: Depending on your manufacturing capabilities and needs, choose between laminate sheets or prepreg in roll or panel form to suit your fabrication process.

Overall, Isola IS410 provides a robust platform for developing reliable, high-performance PCBs, especially in environments where lead-free soldering and high thermal stability are required. Its comprehensive range of Dk and Df values across various frequencies also makes it a versatile choice for diverse electronic applications【4:3†is410-data.pdf】.

Start Your Project



Related Resources


cover image

PCB Materials Datasheets


Datasheets for PCB materials we often use in client projects.

cover image

PCB Material Search


Find the perfect PCB laminate material, powered by PCB Directory.

PCB material selection

PCB Material Selection Guide

By ZM Peterson • Jan 22, 2025

This guide covers material properties, application-specific selection, and key considerations for high-voltage, RF, high-speed digital, and HDI PCBs.



Ready to work with NWES?
Contact us today for a consultation.

Contact Us Today

Our Clients and Partners