This datasheet is made available for informational purposes only. For more information, such as processing guidance and full range of material options, this page includes design guidance that can help you start a new PCB project. For specific processing documentation and additional information, please visit the manufacturer's website.
The Isola IS410 is a high-performance FR-4 epoxy laminate and prepreg system designed for the printed circuit board industry, particularly where higher levels of reliability and lead-free solder compatibility are required. The material features a glass transition temperature (Tg) of 180°C and a decomposition temperature (Td) of 350°C, making it suitable for multiple high-temperature processes. The dielectric constant (Dk) and dissipation factor (Df) vary across different frequencies, which is crucial for designing PCBs that operate at various signal frequencies. For instance, at 1 GHz, the Dk is approximately 3.97 with a Df of 0.0200【4:3†is410-data.pdf】.
When building a PCB stackup using IS410, it's essential to consider the specific requirements of your application, including the operating frequency and environmental conditions. The IS410 material is available in various configurations, with standard laminate thicknesses ranging from 2 to 125 mils and copper foil types such as HTE Grade 3 and RTF (Reverse Treat Foil). The material is also available in both full-size sheet and panel form, as well as in roll or panel form for prepregs, which offers flexibility in PCB design and fabrication【4:3†is410-data.pdf】.
Here are some guidelines for using IS410 in PCB stackup design:
Overall, Isola IS410 provides a robust platform for developing reliable, high-performance PCBs, especially in environments where lead-free soldering and high thermal stability are required. Its comprehensive range of Dk and Df values across various frequencies also makes it a versatile choice for diverse electronic applications【4:3†is410-data.pdf】.
This guide covers material properties, application-specific selection, and key considerations for high-voltage, RF, high-speed digital, and HDI PCBs.