The Isola IS410 is a high-performance FR-4 epoxy laminate and prepreg system designed specifically for the demands of the printed circuit board (PCB) industry, particularly for applications requiring high reliability and compatibility with lead-free soldering. This material is characterized by a glass transition temperature (Tg) of 180°C and a decomposition temperature (Td) of 350°C, making it suitable for high-temperature processes. The dielectric constant (Dk) is 3.97, and the dissipation factor (Df) is 0.0200, which are critical values for determining signal integrity in high-speed applications.

For PCB stackup design using IS410, consider the following guidelines:

• Material Thickness: IS410 laminate is available in thicknesses from 2 to 125 mils (0.05 to 3.2 mm), which provides flexibility in designing PCBs with varying layer counts and thickness requirements.
• Copper Foil Options: It supports copper weights from ½ oz to 2 oz (18 to 70 µm), with options for heavier or thinner copper foils. This range allows for customization based on current carrying capacity and impedance control needs.
• Compatibility with High-Temperature Soldering: IS410 can withstand up to six times the solder float at 288°C, ensuring reliability during lead-free assembly processes.
• CAF Resistance: The unique resin chemistry of IS410 provides resistance to conductive anodic filament (CAF), enhancing the long-term reliability of the PCBs, especially in small feature designs.

Given these attributes, IS410 is an excellent choice for applications requiring robust thermal management and high reliability, such as in automotive, aerospace, and industrial electronics where lead-free soldering is a necessity. The compatibility with FR-4 processing also ensures that it can be integrated into existing manufacturing workflows without the need for additional equipment or substantial process changes.