AGC TacLamplus ultra-thin base materials are specifically designed for mmWave applications, offering a cost-effective solution for creating low-loss structures in both single and multiple dielectric layers. This material is particularly suitable for applications requiring high frequency performance, such as automotive radar and mmWave radios. TacLamplus is characterized by its excellent copper foil adhesion, which supports the resolution of small features, and its dielectric composition, which facilitates clean laser ablation for micro via and component cavity formation. This makes it an ideal choice for advanced PCB designs where precision and reliability are critical.

When building a PCB stackup using TacLamplus, consider the following guidelines to optimize the material's properties:

• Laser Ablation: Utilize the material's laser ablatable nature for precise microvia creation, which is essential for high-density interconnect (HDI) designs.
• Multilayer Capability: Leverage its suitability for sequential multilayer constructions to build complex PCBs required in high-frequency applications.
• Thermal and Electrical Stability: The addition of a 1 mm copper plate can help maintain dimensional stability, provide a robust ground plane, and act as a heat sink, enhancing the PCB's thermal management.

The material's very low dielectric constant (Dk) and dissipation factor (Df) across a wide frequency range (up to 90 GHz) ensure minimal signal loss, which is crucial for mmWave applications. The low moisture absorption and high peel strength further contribute to the durability and reliability of the PCBs. For engineers working on systems such as power amplifiers and mmWave radios, TacLamplus offers a robust substrate that combines performance with manufacturability.