The Shengyi mmWAVE77 material is specifically designed for high-frequency, low-loss applications, making it ideal for use in RF/Microwave environments where maintaining signal integrity is crucial. The material boasts a stable dielectric constant (Dk) of 3.0 ± 0.04 and a low dissipation factor (Df) of 0.0010 at 10 GHz, ensuring minimal signal loss across a broad frequency range from 1 GHz to 100 GHz. This stability is maintained over a wide temperature range from -55℃ to +150℃, which is essential for applications subjected to varying environmental conditions.

For constructing a PCB stackup using Shengyi mmWAVE77, consider the following guidelines:

• Choose the appropriate core and pre-preg thickness based on the desired board rigidity and the electrical requirements. Standard thicknesses available include 0.005” (0.127mm), 0.010” (0.254mm), 0.020” (0.508mm), and 0.030” (0.762mm).
• Ensure that the PCB design accommodates the thermal properties of the material, which has a thermal conductivity of 0.50 W/m/K and a decomposition temperature (Td) of 538℃. This makes it suitable for high-temperature processes and applications.
• Utilize the material’s excellent copper peel strength (1.64 N/mm after solder float) and low moisture absorption (0.01%) to enhance the durability and reliability of the final PCB assembly.

Shengyi mmWAVE77 is particularly suited for applications such as automotive radar, cellular telecommunications systems, global positioning satellite antennas, and other wireless communication devices. Its low moisture absorption and high thermal stability make it an excellent choice for environments that experience extreme temperature fluctuations or are exposed to harsh conditions.