The Shengyi Synamic 6 material is designed for ultra-high speed and ultra-low loss applications in multilayer Printed Wiring Boards (PWBs), particularly suited for high-speed digital applications that demand superior electrical performance. This material features a high glass transition temperature (Tg) of 210°C, ensuring stability under thermal stress, and a low coefficient of thermal expansion (CTE) which enhances the reliability of the finished PCBs under varying temperature conditions. With a dielectric constant (Dk) of 3.50 and a dissipation factor (Df) of 0.0046 at 10 GHz, Synamic 6 provides excellent signal integrity, which is crucial for maintaining performance in high-speed transmission environments.

When building a PCB stackup using Synamic 6, consider the following guidelines:

• Utilize the material's compatibility with high layer count applications and multiple 2 oz. copper layers to design robust and dense PCB layouts.
• Take advantage of the material's excellent CAF (Conductive Anodic Filament) resistance, which is crucial for maintaining the integrity of the electrical paths in fine-pitch applications down to 0.8mm.
• Ensure that the PCB design leverages the stable Dk and Df over a wide range of frequencies (1 GHz to 20 GHz) and temperatures (-40 ºC to +125 ºC), which is essential for applications requiring consistent performance across various operating conditions.

Given its high Tg and low Df, Synamic 6 is particularly well-suited for applications such as high-speed servers, switches, routers, and high layer count backplanes, which are commonly found in advanced computing and telecommunications infrastructure. The material's robust thermal and electrical properties also make it an excellent choice for military and aerospace applications, where reliability and performance are critical.