This datasheet is made available for informational purposes only. For more information, such as processing guidance and full range of material options, this page includes design guidance that can help you start a new PCB project. For specific processing documentation and additional information, please visit the manufacturer's website.
The Rogers RO3003G2™ High Frequency Laminates are specifically designed for high-frequency applications, offering a very low dielectric constant (Dk) and minimal insertion loss, making them ideal for mm-wave automotive radar applications. The material's Dk is specified as 3.00 at 10 GHz and 3.07 at 77 GHz, which are measured using the clamped stripline and microstrip differential phase length methods, respectively. This precision in Dk values is crucial for applications requiring stringent impedance control and phase stability over frequency.
RO3003G2 laminates are fabricated using standard PTFE circuit board processing techniques, albeit with minor modifications. These modifications are detailed in the application note "Fabrication Guidelines for RO3000® Series High Frequency Circuit Materials," which should be consulted to ensure proper handling and manufacturing of the PCBs. The homogeneous construction of the laminate, which incorporates Very Low Profile (VLP) Electrodeposited (ED) copper and a reduced dielectric porosity, helps in minimizing the dielectric constant variation, thus enhancing the performance consistency across the PCB.
When designing a PCB stackup with RO3003G2, it is essential to consider the following aspects:
Overall, Rogers RO3003G2™ High Frequency Laminates are well-suited for advanced radar systems and other high-frequency applications, where performance and reliability are critical. The material's properties and the support provided by Rogers in terms of detailed fabrication guidelines make it a reliable choice for designing sophisticated electronic systems.
This guide covers material properties, application-specific selection, and key considerations for high-voltage, RF, high-speed digital, and HDI PCBs.