This datasheet is made available for informational purposes only. For more information, such as processing guidance and full range of material options, this page includes design guidance that can help you start a new PCB project. For specific processing documentation and additional information, please visit the manufacturer's website.
The RO4830 high frequency laminates from Rogers Corporation are specifically designed for applications in the 76-81 GHz range, such as automotive radar sensors. This material is a cost-effective alternative to traditional PTFE-based laminates, offering a dielectric constant of 3.2 at 77 GHz. The LoPro® reverse treated copper foil used in RO4830 enhances its performance, particularly in terms of insertion loss, which is a critical parameter in high-frequency applications. The laminates exhibit an insertion loss of 2.2 dB per inch at 77 GHz, making them suitable for sensitive millimeter wave applications where minimal signal attenuation is crucial.
For PCB stackup design, RO4830 laminates can be integrated as the cap layer on FR-4 multi-layer board designs. This is particularly advantageous in designs where cost and performance are balanced. The laminates are available in dielectric thicknesses of 0.005” and 0.0094”, allowing flexibility in design depending on the specific application requirements. Additionally, the material's compatibility with standard epoxy/glass (FR-4) processes and RO4400™ bond ply makes it a versatile choice for various PCB constructions. Here are some key considerations for using RO4830 in PCB stackups:
When designing PCBs with RO4830, engineers should consider the specific processing guidelines provided by Rogers Corporation to ensure optimal performance and reliability of the final product. The standard panel sizes and thicknesses offered also provide additional flexibility in design, accommodating a range of application needs from automotive radar systems to other high-frequency electronic components【4:0†RO4830 High Frequency Laminates Data Sheet】.
This guide covers material properties, application-specific selection, and key considerations for high-voltage, RF, high-speed digital, and HDI PCBs.