PCB Material Data For AGC NF-30 Ceramic Filled PTFE Composite

This datasheet is made available for informational purposes only. For more information, such as processing guidance and full range of material options, this page includes design guidance that can help you start a new PCB project. For specific processing documentation and additional information, please visit the manufacturer's website.

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How to Use AGC NF-30 Ceramic Filled PTFE Composite

The AGC NF-30 Ceramic Filled PTFE Composite is a high-performance material specifically designed for use in applications where low electrical loss and stable dielectric properties are critical. This material is particularly suited for high-frequency microwave applications, such as automotive radar sensors, aerospace components, and GPS antennas. The ceramic-filled PTFE composite technology ensures minimal signal distortion and low dielectric loss, making it ideal for applications operating in the 77-79 GHz range.

When building a PCB stackup using AGC NF-30, it is important to consider its excellent thermal and mechanical properties. The material exhibits exceptional dimensional stability, which is crucial for multilayer PCB applications, and maintains low Z-axis expansion in extreme thermal environments. This stability is beneficial in preventing warping and maintaining the integrity of the PCB layers under varying thermal conditions.

For processing, AGC NF-30 can be handled using standard PCB fabrication techniques such as shearing, drilling, milling, and plating. It is also compatible with CO2 laser ablation, which can be utilized for creating precise microvia formations in dense PCB designs. This feature is particularly useful in complex microwave designs where precision is paramount.

  • Dielectric Constant (Dk) at 10 GHz: 3.00 ± 0.04
  • Dissipation Factor at 10 GHz: 0.0013
  • Thermal Decomposition (Td) at 5% weight loss: 986°F (530°C)
  • Thermal Conductivity: 0.5 W/m*K
  • Peel Strength for ½ oz. RTF Cu: 1.4 N/mm (8 lbs/in)

Given these properties, AGC NF-30 is an excellent choice for high-reliability, high-frequency applications where thermal management and electrical performance are critical. Its ability to maintain consistent electrical properties across a wide frequency range makes it a reliable substrate for advanced electronic applications.

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