PCB Material Data For AGC NF-30-A Ceramic Filled PTFE Composite

This datasheet is made available for informational purposes only. For more information, such as processing guidance and full range of material options, this page includes design guidance that can help you start a new PCB project. For specific processing documentation and additional information, please visit the manufacturer's website.

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How to Use AGC NF-30-A Ceramic Filled PTFE Composite

The AGC NF-30-A Ceramic Filled PTFE Composite is a high-performance material designed for use in microwave and RF applications where low electrical loss and stable dielectric properties are critical. This non-reinforced laminate is particularly well-suited for applications such as automotive radar sensors, aerospace components, GPS antennas, and passive components like dividers, filters, and couplers. Its ceramic-filled PTFE composite technology ensures minimal signal distortion and low dielectric loss, making it an excellent choice for designs operating in the 77-79 GHz range.

From a technical standpoint, the NF-30-A offers excellent electrical properties with a dielectric constant (Dk) of approximately 3.0 at 78.1 GHz and a very low dissipation factor (Df) of 0.0013 at 10 GHz. These properties contribute to its superior electrical performance at higher frequencies, where skin effect losses are significant. Additionally, the material's thermal and mechanical properties include excellent dimensional stability and low Z-axis expansion, which are beneficial in extreme thermal environments or multilayer PCB applications.

For PCB fabrication, the NF-30-A can be processed using standard techniques applicable to PTFE materials. It can be sheared, drilled, milled, and plated. Notably, the use of CO2 laser ablation is possible, allowing for precise microvia formation in dense PCB designs. This adaptability makes it a versatile choice for complex microwave designs.

  • Dielectric Constant (Dk): 3.0 at 78.1 GHz
  • Dissipation Factor (Df): 0.0013 at 10 GHz
  • Thermal Coefficient of Dk: -4.07 ppm/°C
  • Thermal Decomposition (Td): 959 °F (515 °C) at 2% weight loss
  • Thermal Conductivity: 0.5 W/m*K
  • Peel Strength: 0.7 N/mm for ½ oz. ULPH Cu
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