The ITEQ IT-968BS/IT-968TC materials are designed for high-performance applications requiring high thermal reliability and excellent electrical properties. These materials are characterized by a high glass transition temperature (Tg) of 185°C, making them suitable for lead-free assembly processes which often require higher temperatures. The materials are also RoHS compliant, ensuring they meet current environmental and safety standards for electronic components.

Key features of the IT-968BS/IT-968TC include their low dielectric constant (Dk) and ultra-low dissipation factor (Df), which are critical for maintaining signal integrity in high-speed applications. The Df is less than 0.005 at 10GHz, providing minimal signal loss, which is essential for applications operating at frequencies above 20GHz. This makes the material particularly suitable for use in multilayer PCBs for backplanes, high-speed servers, and RF and wireless communication systems.

When designing a PCB stackup using ITEQ IT-968BS/IT-968TC, consider the following guidelines:

• Choose the appropriate copper weight and glass style based on the specific electrical and mechanical requirements of your application. The material is available in various constructions, including H-VLP Rz<2um copper foil.
• Ensure compatibility with lead-free soldering processes, as the material can withstand a maximum reflow temperature of 260°C.
• Take advantage of the material's excellent CAF performance and its compliance with industrial standards such as UL 94 V-0 and IPC-4101D.

Overall, ITEQ IT-968BS/IT-968TC is an excellent choice for advanced PCBs requiring high reliability and superior electrical performance, especially in high-frequency and high-temperature environments. Its properties support easier signal simulation and integration into diverse electronic systems, making it a versatile option for modern PCB designs.