This datasheet is made available for informational purposes only. For more information, such as processing guidance and full range of material options, this page includes design guidance that can help you start a new PCB project. For specific processing documentation and additional information, please visit the manufacturer's website.
The Isola GETEK Low Dk/Df Laminate and Prepreg materials are engineered to meet the requirements of high-speed, low-loss Printed Wiring Board (PWB) applications. These materials feature a low dielectric constant (Dk) and low dissipation factor (Df), which are crucial for maintaining signal integrity in high-speed electronic circuits. The laminate and prepreg are made using a functionalized Polyphenylene Oxide (PPO)/epoxy resin, reinforced with electrical grade (E-glass) glass fabric, ensuring robust mechanical and thermal properties. This combination offers a superior performance over traditional FR-4 materials, particularly in terms of thermal stability, with a glass transition temperature (Tg) of 180°C and a decomposition temperature (Td) of 345°C.
When designing a PCB stackup using GETEK materials, the following considerations should be taken into account:
Additionally, the GETEK system includes features like UV blocking and AOI fluorescence, which enhance the throughput and accuracy during PCB fabrication and assembly. This material is also RoHS compliant, making it suitable for use in environments where hazardous substances are regulated. When ordering, GETEK materials are available in various forms including full size sheets or panels for laminates, and rolls or panel form for prepregs, with options for different copper weights and types.
This guide covers material properties, application-specific selection, and key considerations for high-voltage, RF, high-speed digital, and HDI PCBs.