The Isola 370HR is a high-performance epoxy laminate and prepreg designed for the fabrication of multilayer printed wiring boards (PWBs) where high thermal reliability and resistance to conductive anodic filament (CAF) are critical. This material is well-suited for applications that require a high degree of thermal stability and mechanical strength. The 370HR laminate and prepreg are made using a multifunctional epoxy resin system with a glass transition temperature (Tg) of 180°C and a decomposition temperature (Td) of 340°C, making it ideal for high-reliability applications in various markets .

When building a PCB stackup using Isola 370HR, it is essential to consider its compatibility with FR-4 processing, which simplifies integration into existing manufacturing lines. The material is also compatible with high-density interconnect (HDI) technology and can withstand multiple reflow cycles, making it suitable for complex, multi-layer board designs. The 370HR is available in laminate form with thicknesses ranging from 2 to 125 mils and in various copper weights (½, 1, and 2 oz), providing flexibility in design and application .

For engineers looking to utilize Isola 370HR, the following points should be considered:

• Ensure that the PCB design is compatible with the material's specifications, such as its thermal and electrical properties.
• Take advantage of the material's UV blocking and AOI fluorescence features for better inspection and quality control during PCB fabrication.
• Consider the mechanical and chemical resistance properties of 370HR, which are comparable or superior to traditional FR-4 materials, for applications exposed to harsh environments .

Overall, Isola 370HR offers a robust solution for demanding applications that require superior thermal performance, reliability, and ease of processing. Its attributes make it an excellent choice for sectors such as aerospace, automotive, and industrial electronics where long-term reliability is paramount .