Frequently Cited Research on PCB Design


As part of our work developing technical content and providing research services to clients, there is a small set of resources on PCB design and analysis that we cite repeatedly. Our list of our most frequently cited resources has been compiled on this page for reader convenience.

Please note, NWES does not claim to hold any copyright to the publications included on this page, these publications are provided for informational purposes only and all rights are retained by copyright holders. Please obtain original copies of any publications cited below directly from the publisher.


  • Aliyev, J. "Cost-Performance Analysis of Printed Circuit Boards Using Hybrid Stackup." Master's thesis, University of Twente, 2018.
  • Barnes, H., et al. "A Review of 90 Degree Corner Design For High-Speed Digital and mmWave Applications." In 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), pp. 1-3. IEEE, 2020.
  • Boesing, D. "Maximizing RF Launch Performance: The Impact Of GND Vias." Samtec.
  • Bogatin, E., B. Simonovich. "Guard Traces: Love Them or Leave Them?." Signal Integrity Journal, September 5, 2019.
  • Borland, B. "Decoupling of High-Performance Semiconductors Using Embedded Capacitor Technology." In 2006 15th IEEE International Symposium on the Applications of Ferroelectrics (2006).
  • Bruckstein, A. M., and T. Kailath. "Inverse Scattering For Discrete Transmission-Line Models." SIAM Review 29, no. 3 (1987): 359-389.
  • Brooks, D. "Crosstalk Coupling: Single-Ended vs. Differential." UltraCAD Design Inc. Technical Publication, September 2005.
  • Brooks, D. "Differential Impedance: What’s the Difference?" Printed Circuit Design (1998).
  • Brennan, L. E. and L. S. Reed, "Theory of Adaptive Radar." IEEE Transactions on Aerospace and Electronic Systems, vol. AES-9, no. 2, pp. 237-252, March 1973.
  • Caspers, F. "RF Engineering Basic Concepts: S-Parameters." CERN, Geneva, Switzerland.
  • Chang, R. W. Y., et al. "Comprehensive Analysis of the Impact of Via Design on High-Speed Signal Integrity." In 2007 9th Electronics Packaging Technology Conference, pp. 262-266. IEEE, 2007.
  • Collin, R. E. Field Theory of Guided Waves. Vol. 5. John Wiley & Sons, 1990.
  • Coonrod, J. "Advancements in Prepreg Enabling New Applications for Millimeter-Wave (mmWave) and High Speed Digital (HSD)." PCB West 2021.
  • Coonrod, J. "Copper Foils for High Frequency Materials." Rogers Corporation (2021).
  • Coonrod, J. "Understand How Circuit Materials and Fabrication Can Affect PCB Dk Variation and Phase Consistency." Rogers Corporation (2020).
  • Djordjevic, Antonije R., et al. "Wideband Frequency-Domain Characterization of FR-4 and Time-Domain Causality." IEEE Transactions on Electromagnetic Compatibility 43, no. 4 (2001): 662-667.
  • Dmitriev-Zdorov, V., et al. "A Causal Conductor Roughness Model and its Effect on Transmission Line Characteristics." Signal Integrity Journal (2018).
  • DuPont. "Thin Laminates as Embedded Capacitance for PDN Designs." Link: https://www.dupont.com/blogs/thin-laminates-as-embedded-capacitance-for-pdn-designs.html
  • Fesharaki, F., et al. "Guided-Wave Properties of Mode-Selective Transmission Line." IEEE Access 6 (2017): 5379-5392.
  • He, H., and J. J-Q. Lu. "Modeling and analysis of PDN impedance and switching noise in TSV-based 3-D integration." IEEE Transactions on Electron Devices 62, no. 4 (2015): 1241-1247.
  • Heyfitch, V., and Shlepnev, Y. "Design Insights From Electromagnetic Analysis and Measurements of PCB and Package Interconnects Operating at 6-112 Gbps and Beyond." DesignCon 2020.
  • Huang, S., et al. "Reduction of PCB PDN Impedance and Radiated Emissions Using a Hybrid Technique With Absorbing Materials and Decoupling Capacitors." Progress In Electromagnetics Research B 77 (2017): 137-154.
  • Heydari, P., and M. Pedram. "Calculation of Ramp Response of Lossy Transmission Lines Using Two-Port Network Functions." In Proceedings of the 1998 International Symposium on Physical Design, pp. 152-157. 1998.
  • Intel. "224G Package and PCB Investigations and COM Reference." P802.3df Working Group.
  • Johnson, H., and M. Graham. High-Speed Signal Propagation: Advanced Black Magic. Prentice Hall. Upper Saddle River, NJ (2003).
  • Khongdeach, T., et al. "Determination of Power Line Transfer Functions by a Method of Impedance Transfer and Voltage Spread." Progress In Electromagnetics Research M 71 (2018): 63-74.
  • Knighten, J., et al. "PDN Design Strategies: III. Planes and materials–are they important factors in power bus design?" IEEE EMC Society Newsletter 208 (2006): 56-67.
  • Lampinen, J. "A constraint handling approach for the differential evolution algorithm," Proceedings of the 2002 Congress on Evolutionary Computation, CEC'02 (Cat. No.02TH8600), Honolulu, HI, USA, vol. 2, pp.1468-1473 (2002).
  • Lapedus, M. "Radar vs. LiDAR." Semiconductor Engineering 9, October 2017.
  • Li, L., et al. "A transition from substrate integrated waveguide (SIW) to rectangular waveguide." In 2009 Asia Pacific Microwave Conference, pp. 2605-2608. IEEE, 2009.
  • Manukovsky, A., et al. "Machine Learning Applications for COM Based Simulation of 112Gbs Systems." Signal Integrity Journal (2020).
  • Moore, C., and Healey, A. "A method for evaluating channels." 100 Gb/s Backplane and Copper Study Group, IEEE, 2011.
  • Neves, A., et al. "32 to 56 Gbps Serial Link Analysis and Optimization Methods for Pathological Channels." DesignCon 2017.
  • Novak, I. "SUN's Experience with Thin and Ultra Thin Laminates for Power Distribution Applications." DesignCon 2006.
  • Pozar, D. M. Microwave Engineering, 4th Edition. John Wiley & Sons, Inc. Hoboken, NJ (2012).
  • Rollett, J. "Stability and power-gain invariants of linear twoports." IRE Transactions on Circuit Theory 9, no. 1 (1962): 29-32.
  • Roy, K., et al. "Inverse design of transmission lines with deep learning." In 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), pp. 1-3. IEEE, 2019.
  • Royo, S., and M. Ballesta-Garcia. "An overview of lidar imaging systems for autonomous vehicles." Applied Sciences 9, no. 19 (2019): 4093.
  • Sain, Arghya, and Kathleen L. Melde. "Impact of Ground Via Placement in Grounded Coplanar Waveguide Interconnects." IEEE Transactions on Components, Packaging and Manufacturing Technology 6, no. 1 (2015): 136-144.
  • Shlepnev, Y. "Practical Methodology For Analyzing the Effect of Conductor Roughness on Signal Losses and Dispersion in Interconnects." DesignCon 2012.
  • Simonovich, B. "PCB Interconnect Modeling Demystified." DesignCon 2019.
  • Simonovich, B. "Practical Model of Conductor Surface Roughness Using Cubic Closepacking of Equal Spheres." EDI CON 2016.
  • Simonovich, B. "Via Stub Termination -Brought to You by 'The Stubinator'." Bert Simonovich Design Notes, January 27, 2011.
  • Storn, R., and Price, K. "Differential Evolution - A Simple and Efficient Heuristic for Global Optimization over Continuous Spaces." Journal of Global Optimization, 11, pp.341-359 (1997).
  • Tsiklauri, M., et al. "Causality and Delay and Physics in Real Systems." In 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC), pp. 961-966. IEEE, 2014.
  • Triverio, P., et al. "Stability, Causality, and Passivity in Electrical Interconnect Models." IEEE Transactions on Advanced Packaging 30, no. 4 (2007): 795-808.
  • Vardapetyan, A., and C-J. Ong. "Via Design Optimization For High Speed Differential Interconnects on Circuit Boards." In 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), pp. 1-3. IEEE, 2020.
  • Waeytens, R., et al. "Analysis of the Influence of Roughness on the Propagation Constant of a Waveguide via Two Sparse Stochastic Methods." In 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), pp. 1-3. IEEE, 2020.
  • Wadell, B. C. Transmission Line Design Handbook. Artech House. Norwood, MA (1991).
  • Weir, S. "PDN Application of Ferrite Beads." DesignCon 2011.
  • Wilfredo, Rivas-Torres. "Automotive Radar Fast Chirp System Analysis." Keysight, January 2019.
  • Wu, R.-B. and J-C. Yang, "Boundary integral equation formulation of skin effect problems in multiconductor transmission lines." IEEE Transactions on Magnetics, 25(4), 3013-3015 (1989).
  • Xiao, F., and Y. Kami. "Modeling and Analysis of Crosstalk Between Differential Lines in High-Speed Interconnects." PIERS Online 3, no. 8 (2007): 1293-1297.
  • Xin, W., et al. "Surface finish effects on high-speed signal degradation." IEEE Transactions on Advanced Packaging 31, #1, pp. 182-189 (2008).
  • Zhang, J., et al. "Causal RLGC(f) Models for Transmission Lines From Measured S-Parameters." IEEE Transactions on Electromagnetic Compatibility, 52(1), pp.189-198 (2009).
  • Zhang, J., et al. "Planar Transmission Line Method For Characterization of Printed Circuit Board Dielectrics." Progress In Electromagnetics Research 102 (2010): 267-286.


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