PCB Material Search

Data compiled from pcbdirectory.com

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Panasonic Corporation - R-G515E

  • Dk: 4.4
  • Df: 0.008
  • Tg: 220 to 240 ˚C
  • Frequency: 0 to 10 GHz
  • Cte xy: 4 to 6 ppm/˚C
  • Industry application: Automotive,Telecom
  • Peel strength: 0.7 kN/m
more info
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Rogers Corporation - duroid 5880LZ

  • Type: Copper-clad
  • Frequency: 10 GHz
  • Lead Free: yes
  • Cte xy: 54, 47 ppm/˚C
  • Cte z: 40 ppm/˚C
  • Electrical strength: 40 kV
  • Flamibility: V-0
more info
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Isola Group - IS400

  • Description: Lead-free Mild Tg Laminate and Prepeg
  • Td: 330 ˚C
  • Tg: 150 ˚C
  • UL: yes
  • Lead Free: yes
  • Cte xy: 13 ppm/˚C
  • Cte z: 50 to 250 ppm/˚C
more info
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Kingboard Holdings Limited - KB-6160F

  • Type: Copper-clad
  • Dk: 5.4
  • Frequency: 0.1 to 1 GHz
  • Flamibility: UL94 Rating
  • Material: FR-4
  • Moisture absorbtion: 0.005
  • Peel strength: 1.05, 0.80, 0.70 N/mm (lb/inch)
more info
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ITEQ Corporation - IT-150GSTC

  • Type: Halogen-free
  • Td: 365 ˚C
  • Tg: 155 ˚C
  • UL: Yes
  • Halogen Free: Yes
  • Applications: Server, Storage, Switch, Routers
  • Cte xy: 11 to 13 ppm/˚C
more info
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DuPont - Pyralux AC Single-side Clad

  • Type: Copper-clad
  • Dk: 3.4 to 3.7
  • Df: 0.003 to 0.005
  • Frequency: 0.1 to 10 GHz
  • UL: yes
  • Lead Free: No
  • RoHS: yes
more info
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Chin-Shi Electronic materials Ltd - CS-AL-88/89 L2

  • Td: 410 ˚C
  • Tg: 100 ˚C
  • UL: Yes
  • Halogen Free: Yes
  • Applications: LED, Ignition Device, Voltage Regulator, AC Transformer, Relay, Transistor Base, CPU
  • RoHS: Yes
  • CTI: 600 V
more info
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AGC Inc - METEORWAVE 8300

  • Type: High Temp
  • Dk: 3
  • Df: 0.0025
  • Td: 376 ˚C
  • Tg: 190 ˚C
  • UL: Yes
  • Cte xy: 14-16 ppm/˚C
more info
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Arlon EMD - 37N

  • Type: Copper-clad
  • Dk: 4.25
  • Df: 0.018
  • Tg: 200 ˚C
  • Frequency: 0.1 GHz
  • Lead Free: yes
  • Arc resistance: 124 Sec
more info
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Nan Ya Plastics Corp - NPG-170DR

  • Type: Halogen-free
  • Td: 380 ˚C
  • Tg: 170 ˚C
  • UL: Yes
  • Halogen Free: Yes
  • Arc resistance: 120 sec
  • Dielectric breakdown: 60 kV
more info

How to Build Your PCB Stackup

Many PCBs will not function properly without the right dielectric materials as these influence EMI, signal integrity, and power integrity. The other dimension to consider on many mass-produced products is cost, as material selection will be a major factor determining volume production expense. To start building your own PCB stackup, follow these steps:

  • Prioritize your specifications - All PCB laminate materials come with tradeoffs, requiring a balance among cost, dielectric properties, and thermal reliability. Start by determining the important specifications before selecting material sets and planning your PCB layer assignments.

  • Review materials datasheets - Once base materials are selected, review the material datasheets, consult a PCB design services firm, or consult a PCB manufacturer for more information on use cases and laminate thickessness for you selected material set.

  • Check with your fabricator - Before finalizing your stackup design, have the design reviewed by a competent fabrication house. Hyrid PCB stackups builds, HDI PCB materials, thin PTFE laminates, and metal-core or ceramics all require special processing during fabrication to ensure reliability.

The typical stackup arrangement shown below illustrates the stackup design approach and layer assigments in many commercial products. In between each of the signal/plane layer groups, additional signal layers may be present as needed, often being used to route important high-speed signals or large copper pours for power routing.

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