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  • material: Polyimide
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    Ventec International Group - VT-901N

    • Td: 390 ˚C
    • Tg: 200 ˚C
    • Lead Free: Yes
    • Arc resistance: 150 Sec
    • Cte xy: 12/15 ppm/˚C
    • Cte z: 50 to 230 ppm/˚C
    • Dielectric breakdown: 60 kV
    more info
    Product Image

    Resonac Corporation - MCL-I-671

    • Type: High Temp
    • Tg: 230 to 245 ˚C
    • Applications: Main frame computers and super computers, Semiconductor testing equipment, and burn-in boards, Flex-rigid PWBs
    • Cte xy: 12 to 15 ppm/˚C, 12 to 16 ppm/˚C
    • Cte z: 50 to 80 ppm/˚C, 200 to 300 ppm/˚C
    • Material: Polyimide, FR-4
    • Peel strength: 1.3 to 1.5 kN/m, 1.0 to 1.2 kN/m
    more info

    How to Build Your PCB Stackup

    Many PCBs will not function properly without the right dielectric materials as these influence EMI, signal integrity, and power integrity. The other dimension to consider on many mass-produced products is cost, as material selection will be a major factor determining volume production expense. To start building your own PCB stackup, follow these steps:

    • Prioritize your specifications - All PCB laminate materials come with tradeoffs, requiring a balance among cost, dielectric properties, and thermal reliability. Start by determining the important specifications before selecting material sets and planning your PCB layer assignments.

    • Review materials datasheets - Once base materials are selected, review the material datasheets, consult a PCB design services firm, or consult a PCB manufacturer for more information on use cases and laminate thickessness for you selected material set.

    • Check with your fabricator - Before finalizing your stackup design, have the design reviewed by a competent fabrication house. Hyrid PCB stackups builds, HDI PCB materials, thin PTFE laminates, and metal-core or ceramics all require special processing during fabrication to ensure reliability.

    The typical stackup arrangement shown below illustrates the stackup design approach and layer assigments in many commercial products. In between each of the signal/plane layer groups, additional signal layers may be present as needed, often being used to route important high-speed signals or large copper pours for power routing.

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