PCB Material Search

Data compiled from pcbdirectory.com

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  • Type: Copper-clad
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    Material Type

    Loss Tangent (Df)

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    Glass Transition Temperature (Tg)

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    UL Compliant

    RoHS Compliant

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    Rogers Corporation - RO4350B

    • Type: Copper-clad
    • Td: 390 ˚C
    • Tg: 280 ˚C
    • Frequency: 8 to 40 GHz
    • Lead Free: yes
    • Cte xy: 14, 16 ppm/˚C
    • Cte z: 35 ppm/˚C
    more info
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    DuPont - FR0111

    • Type: Copper-clad
    • UL: Yes
    • RoHS: Yes
    • Flamibility: 94V-0
    • Material: FR-4
    • Peel strength: After Lamination- 1.6 (9.0) N/mm (lb/in), After Solder- 1.6 (9.0) N/mm (lb/in)
    • Surface resistivity: 1X10^13 Mohms
    more info
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    Rogers Corporation - CuClad 6700

    • Type: Copper-clad
    • Dk: 2.35
    • Df: 0.0025
    • Frequency: 10 GHz
    • Arc resistance: 130-140 Sec
    • Electrical strength: 1000 V/mil
    • Industry application: Aerospace and defence
    more info
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    Kingboard Holdings Limited - KB-6160A

    • Type: Copper-clad
    • Dk: 5.4
    • Frequency: 0.1 to 1 GHz
    • Flamibility: UL94 Rating
    • Material: FR-4
    • Moisture absorbtion: 0.005
    • Peel strength: 1.05, 0.80, 0.70 N/mm (lb/inch)
    more info
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    DuPont - TAS121500

    • Type: Copper-clad
    • Tg: 280 ˚C
    • UL: Yes
    • Cte xy: 24 ppm/˚C
    • RoHS: Yes
    • Flamibility: 94V-0
    • Material: Polyimide
    more info
    Product Image

    Rogers Corporation - DiClad 880

    • Type: Copper-clad
    • Df: 0.0009
    • Frequency: 0.001 to 10 GHz
    • Arc resistance: 180 Sec
    • Cte xy: 25, 34 ppm/˚C
    • Cte z: 252 ppm/˚C
    • Dielectric breakdown: 45 kV
    more info
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    DuPont - HT0100

    • Type: Copper-clad
    • Td: 548 to 579 ˚C
    • Tg: 233 ˚C
    • UL: Yes
    • Cte xy: 50 to 250 ppm/˚C
    • Cte z: 54 to 230ppm/˚C
    • RoHS: Yes
    more info
    Product Image

    Rogers Corporation - RO4533

    • Type: Copper-clad
    • Tg: 280 ˚C
    • Frequency: 10 GHz
    • Lead Free: yes
    • Cte xy: 13, 11 ppm/˚C
    • Cte z: 37 ppm/˚C
    • Dimensional stability: 0.3 m/m
    more info
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    Kingboard Holdings Limited - KB-3151HS

    • Type: Copper-clad
    • RoHS: Yes
    • Flamibility: UL94 Rating
    • Material: FR-1
    • Moisture absorbtion: 0.013
    • Peel strength: 1.2 N/mm (lb/inch)
    • Surface resistivity: 1 x10^11 , 1 x 10^10 Mohm
    more info
    Product Image

    DuPont - FR0100

    • Type: Copper-clad
    • UL: Yes
    • RoHS: Yes
    • Material: FR-4
    • Peel strength: After Lamination- 1.6 (9.0) N/mm (lb/in), After Solder- 1.6 (9.0) N/mm (lb/in)
    • Surface resistivity: 1X10^15 Mohms
    • Volume resistivity: 1X10^15 Mohms-cm
    more info

    How to Build Your PCB Stackup

    Many PCBs will not function properly without the right dielectric materials as these influence EMI, signal integrity, and power integrity. The other dimension to consider on many mass-produced products is cost, as material selection will be a major factor determining volume production expense. To start building your own PCB stackup, follow these steps:

    • Prioritize your specifications - All PCB laminate materials come with tradeoffs, requiring a balance among cost, dielectric properties, and thermal reliability. Start by determining the important specifications before selecting material sets and planning your PCB layer assignments.

    • Review materials datasheets - Once base materials are selected, review the material datasheets, consult a PCB design services firm, or consult a PCB manufacturer for more information on use cases and laminate thickessness for you selected material set.

    • Check with your fabricator - Before finalizing your stackup design, have the design reviewed by a competent fabrication house. Hyrid PCB stackups builds, HDI PCB materials, thin PTFE laminates, and metal-core or ceramics all require special processing during fabrication to ensure reliability.

    The typical stackup arrangement shown below illustrates the stackup design approach and layer assigments in many commercial products. In between each of the signal/plane layer groups, additional signal layers may be present as needed, often being used to route important high-speed signals or large copper pours for power routing.

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