We're a PCB layout services company with extensive experience designing and producing mixed-signal circuit boards. We build advanced mixed-signal systems like sensor interface platforms, industrial control systems, and IoT products. Our designs operate with multiple digital and analog interfaces running at a range of frequencies. In addition to PCB design and layout services, we provide embedded systems development services for client projects and help streamline the transition to volume production.
We're passionate about advanced technology and we're dedicated to helping you take your new products to market quickly. Whether you're a small startup with a great idea or a large enterprise, we'll take your design from idea to full-scale manufacturing. We look forward to working with you!
Miniaturization and feature diversity in modern electronics is driving integration of digital and analog capabilities in many applications. The systems we design mix digital protocols with one or more specialized analog interfaces, ensuring low-noise operation and scalable manufacturability.
Placing analog and digital sub-circuits on the same PCB creates potential for crosstalk that destroys analog signal fidelity if the layout is not floorplanned and routed correctly. We bring digital and analog design expertise to mixed-signal systems with a major focus on physical layout to ensure proper functionality:
We serve multiple industries and markets with advanced electronic systems operating in demanding environments.
As an advanced electronics design company, our goal is to successfully transition your mixed-signal designs from concept to product. Our network of manufacturing partners can help you produce your mixed-signal systems at scale while streamlining sourcing and ensuring quality.
Some mixed-signal circuit board design requirements in contemporary application areas are outlined in the table below.
Application Area | Design Requirements |
---|---|
Mil-Aero & Commercial Space | • Wide dynamic range requirements • May require multiple high-speed computing protocols (PCIe, Gbps Ethernet, SerDes, DDR3+, etc.) • May integrate a wireless protocol alongside low-frequency senmsor interface • Rugged construction with high power handling, shock, thermal, and vibration requirements |
IoT/IIoT Products | • May be dedicated to a small number of analog interfaces with on-board acquisition and processing • Highly integrated MCU, MPU, or FPGA used for system control • Low-layer counts and small form factor • Low power requirements with power management on-board |
Sensor Interfaces | • System may operate with multiple frequency ranges and bandwidths • Multiple high-speed computing protocols (PCIe, Gbps Ethernet, SerDes, DDR3+, etc.) • Typically built around an MPU or custom application processor, but FPGAs are becoming more popular • Aggressive form factor with thermal management challenges |
Industrial Systems | • May require high power handling and exposure to harsh operating conditions • May be part of a multi-board system where an external controller collects and processes data • Multiple digital and analog interfaces used to collect and transmit sensor data • Rugged construction with strict environmental requirements |
Precision Measurement | • Typically low SNR measurements required in presence of a digital sub-system • Requires precise interface design to couple desired signal to the signal acquisition sub-system • May be built around a feature-dense application processor with multiple interfaces • On-board specialty processing may be implemented in an FPGA |
Automotive systems | • Typically low-frequency measurements with few digital interfaces • Significant potential for EMI within a vehicle • Small form factor and lowest possible layer count typically demanded • Rugged construction required to withstand vibration, shock, and heat |