HDI PCB Design

Today's electronics have followed the same trend as Moore's Law: more technology and features are being packed into smaller spaces to realize advanced applications. High density interconnect (HDI) PCB design techniques are used to create and layout these advanced assemblies with high component and routing densities, as well as very high layer counts.

At NWES, we help clients push the limits of their designs to the cutting-edge with industry-standard HDI PCB design techniques. We help innovative startups and large enterprise create and qualify their HDI designs, as well as aid the transition from concept to full-scale HDI PCB manufacturing. We look forward to working with you!

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HDI PCB Design Capabilities

We Build Advanced HDI Electronics

Large-scale integration in HDI PCB layout involves multiple low-speed and high-speed digital protocols, as well as a cleear focus on best DFM practices to ensure high-yield production. We adopt a production-first mindset when floorplanning your design, and we'll ensure your high-density PCB layout meets the needs of advanced applications.

  • HDI PCBs with multiple digital protocols (DDR, PCIe, SerDes, LVDS, etc.)
  • High-density double-sided designs with multiple BGAs
  • System-on-module (SOM)/computer-on-module (COM) and baseboard designs
  • High layer (18+) count backplanes and daughtercards

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Success in HDI PCB Design

HDI PCB designs carry important material requirements and component selection considerations that are not found in many other systems. Once your new design has passed review and is ready for production, we’ll engage with our manufacturing partners to get your design through production and bring you the most value:

  • HDI stackup design - An HDI stackup will be a major determinant of successful manufacturing and solvability in an HDI PCB layout. Layer counts, routing/via style, and HDI material selection must be qualified with a manufacturer before the design begins.

  • Floorplanning - HDI systems generally involve at least one BGA with high ball count and fine pitch. BGAs, high pin count connectors, peripherals, should be placed early to ensure a coherent plan for routing that does not require addition of new layers late in the design phase.

  • Interconnect design - Stackup design is related to transmission line design for any high-speed impedance-controlled protocols in an HDI PCB. Interconnects must be designed while to hit impedance and loss targets while accounting for skew constraints, flight times, and routing paths in an HDI PCB stackup.

  • Via design - Manufacturable and reliable via design is critical in HDI PCBs. This will also influence the stackup design choices as vias require specific material and thickness choices to ensure manufacturability and reliability.

HDI design starts with a manufacturable stackup that can meet your routing needs, as well as your impedance and loss targets. Standard HDI stackups with via/microvia placement and layer access capabilities are shown below.

HDI Stackup Type Via Style

Ultra-HDI PCB Design & Substrates

As interconnect densities continue to increase, designers must take an ultra-HDI approach that enables innovative electronics packaging, including substrate-like PCBs and advanced substrates for integrated circuits.

  • Substrate-like PCB design
  • Traditional BGA, chip-scale, and flip chip substrates
  • Chip-on-board packaging
  • Multi-chip module design

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Application Areas

Our design expertise is critical to helping clients operate at the cutting edge of technology. Some of the application areas where we operate include:

  • Custom HDI motherboards, single-board computers, and computer peripherals
  • Designs with large FPGAs for defense and aerospace
  • Industrial control and automation
  • Products for commercial space, radar, data center, IoT, and more

Our goal is to successfully transition you from concept to product with a fully manufacturable design that can be produced anywhere. Our network of manufacturing partners can help you produce HDI PCB assemblies at scale while staying compliant, sourcing efficiently, and ensuring high yield.

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Our HDI PCB Design Process

Our goal is to streamline the innovation process for advanced electronics and help clients scale to volume production.
  • Contact us for a consultation and quote.

  • Schematic capture begins and performance requirements for the important RF elements are determined. The stackup will also be designed during this phase to ensure performance targets are achievable.

  • Based on components selected for the design, routing paths are planned, and an HDI stackup is proposed and qualified.

  • After qualifying the stackup and finalizing material requirements, components are placed and we work through the PCB layout.

  • A final DFM/DFA check and any other required simulations are performed before sending you a complete PCB manufacturing deliverable package.

How We Work

Why Work With NWES?

  • Broad expertise - We're a digitally-driven remote-first organization with diverse talent and experience. We know your technology because we've used it and built it.

  • Manufacturing partners - We work with local and overseas CMs and EMS providers that are ISO-9001, AS9100, ISO-13485, IPC-A-610, NADCAP, and/or ITAR/JCP certified. We help you find the best option to produce prototypes and scale to volume production.

  • Supply chain management - We take a proactive approach on projects to ensure your design can be produced at the required volume. We'll manage procurement from major distributors or brokers throughout your project.

Get Started

Need a hand with a current or future PCB design project? Find out the difference our experts can make.

Contact us today for more information.


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