We provide PCB design and layout services for flex and rigid-flex PCBs targeting harsh environments and small form factors. We target applications as diverse as consumer electronics and high-reliability hardware for defense, aerospace, and automotive. We also help clients scale into production through our network of manufacturing partners.
We're passionate about advanced technology. We work with innovative companies to design and build high-reliability products that push the limits of flex and rigid-flex PCB design. Whether you're a small startup with a great idea or a large enterprise, we'll take your design from idea to full-scale manufacturing. We look forward to working with you!
High-reliability electronics often rely on flex or rigid-flex PCB assemblies to withstand harsh environments and hit form factor targets. These designs can be challenging in modern desing approaches, but our expertise will guide you to success.
Engineers who start working with flex designs will quickly find that some of the basic design rules and assembly constraints differ significantly from the constraints in rigid PCBs. Add in the material selection and layer buildup requirements, and flex designs require a unique approach to material selection, component placement, and PCB layout.
Building flex PCB stackups involves a different set of manufacturing requirements and design considerations compared to rigid PCBs. As shown in the typical example below, flex boards can also incorporate rigid glass + epoxy sections, forming rigid-flex assemblies.
Commercially available flex PCB materials and their important materials properties are outlined in the table below. These materials are applicable for most applications involving power, data, or wireless.
Material Type | Primary Usage | Material Data |
---|---|---|
Kapton (Adhesiveless) | Common substrate for flex PCBs | • Dielectric constant: 3.4 • Loss tangent: 0.003 • Tensile strength: ~50 kpsi • CTE (ppm/K): 20 • Hygroscopicity (ASTM D570): 0.8% |
Kapton (Adhesive-coated) | Used as bonding or coverlay layer | • Dielectric constant: 3.4 • Loss tangent: 0.01 • Tensile strength: ~25 kpsi • CTE (ppm/K): 20 • Hygroscopicity (ASTM D570): 3.0% |
Mylar (Adhesiveless) | Substitute for adhesiveless Kapton | • Dielectric constant: 3.0 • Loss tangent: 0.018 • Tensile strength: ~30 kpsi • • CTE (ppm/K): 27 • Hygroscopicity (ASTM D570): 0.8% |
Our flex PCB clients demand high reliability with ambitious form factor, and our expertise helps our clients achieve their goals. Some of the application areas where we operate include:
Our goal is to successfully transition you from concept to product with a fully manufacturable design that can be produced anywhere. Our network of manufacturing partners can help you produce RF systems at scale while staying compliant, sourcing efficiently, and ensuring high yield.